水晶滤光片(OLPF)制造核心：石英晶体的切割与厚度的控制
本公司(苏州利楠光学科技有限公)专业生产和研发各种Cover Glass(化学强化、印刷玻璃，可镀AR，AF防水膜等膜系、可贴合各种材料的背胶)。各种光学&浮法玻璃、各种晶体材料、石英材料的抛光片。各种镀膜反射型滤光片(有D263等玻璃基材，也有水晶基材的OLPF等)、各种多层胶合滤光片(如多层胶合OLPF光学低通滤波器)等、吸收型（有色玻璃）滤光片、带通滤光片、长波通滤光片等各种类型滤光片。各种材料的窗口片、各种防护片&防尘片、中灰性镜片（ND镜)。
Our company specializes in producing and developing various Cover Glasses (chemically strengthened, printed glass, AR and AF waterproof coatings, etc., with back adhesive suitable for various materials). We also produce polished plates from various types of glass, crystal materials, and quartz materials. Our product range includes various reflective filter films (such as D263 glass substrates and crystal-based OLPF), multi-layer bonded filter films (like multi-layer bonded OLPF optical low-pass filters), absorptive (colored glass) filters, bandpass filters, longpass filters, and other types of filters. Additionally, we offer window films, protective films & dust-proof films, and neutral density (ND) lenses made from various materials.
石英晶体（Quartz Crystal）俗称水晶，成分为Sio2，密度:2.65g/cm3,莫氏硬度为7，透明晶莹，是很好的光学材料&压电材料。水晶是单晶体，反映在宏观上就是外形的对称性，晶体可以是天然的，也可是人工培养，目前量产的石英晶体多为人工培养。
Quartz crystal, commonly known as crystal, is composed of SiO2, with a density of 2.65g/cm3 and a Mohs hardness of 7. It is transparent and crystal clear, making it an excellent optical and piezoelectric material. Crystal is a single crystal, which is reflected in its macroscopic symmetry in appearance. Crystals can be natural or artificially cultivated. Currently, most mass-produced quartz crystals are artificially cultivated.
石英晶体具有压电效应和双折射效应（Quartz crystals exhibit piezoelectric and birefringence effects）：
1.压电效应：
石英晶体在某些方向上受到某些力的作用（如压缩、拉伸等）而使其内部发生极化，产生表面电荷现象，叫压电现象。反之，将石英晶体置于外电场中，由于电场作用，会引起内部正负电荷中心位移，而这一位移导致晶体发生变形，这种效应为逆电压效应，而能产生压电效应的轴向我们称为电轴（Ｘ轴）
1. Piezoelectric effect:
Quartz crystals are subjected to certain forces in certain directions (such as compression, tension, etc.), which cause polarization inside and generate surface charge phenomena, known as piezoelectric phenomena. On the contrary, placing a quartz crystal in an external electric field will cause displacement of the internal positive and negative charge centers due to the electric field effect, which leads to deformation of the crystal. This effect is called the reverse voltage effect, and the axis that can generate the piezoelectric effect is called the electric axis (X-axis)
2.光学双折射效应：
当一束光射入石英晶体时，分裂成两束不同方向传播 的光，其中一束光遵循折射定律叫寻常光（O光）。另一束光不遵循折射定律，叫异常光（E光），这种现象为双折射现象。
2. Birefringence:
When a beam of light enters a quartz crystal, it splits into two beams propagating in different directions, one of which follows the law of refraction and is called ordinary light (O light). Another beam of light that does not follow the law of refraction is called anomalous light (E-light), and this phenomenon is called birefringence.
在水晶滤光片(OLPF)原材料石英晶体的制造体系中，切割角度(晶体取向)&晶片厚度是决定产品核心性能的几大关键参数。二者直接关联产品分光点&分光距离&分光角度等核心指标，其取值需严格匹配CCD&CMOS芯片参数以及晶体切割类型(如AT 切、BT切)及回转角度(方向角&旋转角相对应的角度)及终端系统应用的需求,是实现石英晶体功能精准落地的基础。
In the manufacturing system of quartz crystals, the raw material for crystal filters (OLPF), the cutting angle (crystal orientation) and chip thickness are several key parameters that determine the core performance of the product. The two are directly related to core indicators such as the light splitting point, splitting distance, and splitting angle of the product. Their values need to strictly match the parameters of CCD&CMOS chips, crystal cutting types (such as AT cutting and BT cutting), rotation angles (angles corresponding to direction and rotation angles), and the requirements of terminal system applications. This is the basis for achieving precise implementation of quartz crystal functions.
上图为石英晶体（人造水晶）材料（The above picture shows the material of quartz crystal (artificial crystal):）
一、切割角度(方向角和回转角)：滤光片(OLPF)性能的 “定向密码”
切割角度指石英晶体晶格平面与晶体固有晶轴光轴(Z轴)的夹角，它本质上决定光通过石英晶片之后的光学特性-分光角度，是区分不同类型的核心依据之一。
Cutting angle (direction angle and return angle): the "directional password" for the performance of optical filters (OLPF)：
The cutting angle refers to the angle between the lattice plane of a quartz crystal and the intrinsic crystal axis (Z-axis), which essentially determines the optical characteristics of light passing through the quartz crystal - the splitting angle, and is one of the core criteria for distinguishing different types.
1.1 常规石英晶体切割类型及关键参数(Conventional quartz crystal cutting types and key parameters)
• AT 切型：常规切割角度为与光轴呈 45°，
AT cutting type: The conventional cutting angle is 45 degrees from the optical axis,
• BT 切型：常规切割角度为与光轴呈 45°，但其晶格取向与AT切型相反，导致光传播特性呈现显著差异，尤其在双折射效应和分光行为上表现不同。这两种切割方式均需精确控制方向角与回转角，以确保出射光束满足滤光片所需的相位延迟与偏振分离要求。角度偏差超过±1°即可能引发分光点偏移或消光比下降，直接影响成像系统的对比度与分辨率。因此，实际加工中须结合CCD&CMOS相应参数系统光路设计进行协同优化，确保光学响应与探测器响应匹配，实现精准的空间频率抑制与图像去莫尔条纹功能。
BT cutting type: The conventional cutting angle is 45 ° to the optical axis, but its lattice orientation is opposite to the AT cutting type, resulting in significant differences in light propagation characteristics, especially in birefringence and spectral behavior. Both cutting methods require precise control of the direction angle and return angle to ensure that the outgoing beam meets the phase delay and polarization separation requirements of the filter. An angle deviation exceeding ± 1 ° may cause a shift in the light distribution point or a decrease in the extinction ratio, directly affecting the contrast and resolution of the imaging system. Therefore, in actual processing, it is necessary to combine the corresponding parameter system optical path design of CCD&CMOS for collaborative optimization, ensuring that the optical response matches the detector response, and achieving precise spatial frequency suppression and image Moir é fringe removal function.
1.2 切割角度的精准确定流程(Accurate determination process of cutting angle)
（1）基于应用需求逆向选型
首先明确终端产品的核心指标：方向角度、回转角度、厚度需求等。根据上述指标筛选匹配的切割类型。
Reverse selection based on application requirements
Firstly, clarify the core indicators of the terminal product, including direction angle, rotation angle, thickness requirements, etc. Filter the matching cutting types based on the above indicators.
（2）X 射线衍射取向定位
采用高精度 X 射线衍射仪对石英晶棒进行晶轴标定，核心原理是利用晶体晶格对 X 射线的衍射效应，精准识别晶轴（X、Y、Z 轴）的空间位置，误差一般控制在 ±1° 以内。
X-ray diffraction orientation positioning
The high-precision X-ray diffractometer is used to calibrate the crystal axis of quartz crystal rods. The core principle is to use the diffraction effect of the crystal lattice on X-rays to accurately identify the spatial position of the crystal axis (X, Y, Z axis), with an error generally controlled within ± 1 °.
二、晶片厚度：分光点距离的 “量化标尺”(2Chip thickness: a "quantitative ruler" for dividing the distance between light points)
水晶滤光片(OLPF)的分光点两点（正常光O光与异常光E光)之间的距离与晶片厚度有严格的紧密关系，这决定了水晶滤光片在后续系统中的使用效果(如莫尔条纹的改善效果,分辨率,对比度等).
The distance between the splitting points (normal light O light and abnormal light E light) of the crystal filter (OLPF) is closely related to the thickness of the chip, which determines the effectiveness of the crystal filter in subsequent systems (such as the improvement effect of Moir é fringes, resolution, contrast, etc.)
1.厚度的精准确定与实现流程( Accurate determination and implementation process of thickness)
（1）切割（cutting）
使用多线切割对石英晶棒进行粗切成片，将晶棒切割为接近理论厚度的晶片毛坯片
Use multi line cutting to roughly cut quartz crystal rods into slices, and cut the crystal rods into rough chip blanks close to the theoretical thickness
（2）精密研磨与抛光（Precision grinding and polishing）
研磨(减薄)阶段采用金刚石微粉进行双面研磨，去除切割损伤层，将厚度公差控制在±0.003mm
During the grinding (thinning) stage, diamond micro powder is used for double-sided grinding to remove the cutting damage layer and control the thickness tolerance within ± 0.003mm
- 抛光阶段通过氧化铈抛光工艺，使晶片表面由“毛玻璃”抛光为“亮玻璃”,粗糙度 Ra≤1nm，同时将厚度误差压缩至 ±0.01mm(具体可根据客户图纸要求控制)。
During the polishing stage, the cerium oxide polishing process is used to polish the surface of the chip from "ground glass" to "bright glass", with a roughness Ra ≤ 1nm, while compressing the thickness error to ± 0.01mm (which can be controlled according to customer drawing requirements)
